If you require the NSN part 5962-8764903BYB, manufactured by Dla Land And Maritime having CAGE Code 67268 and categorized under FSC 5962 Microcircuits Electronic under NSN 5962013014165, then look no further than NSN Gamut. Our company, which is owned and managed by ASAP Semiconductor, a distributor in the aerospace and defense industry, has an inventory of over two billion new and obsolete NSN parts, including part 5962-8764903BYB Microcircuit Memory and many more.
At NSN Gamut, we have a strict policy of not sourcing from China, ensuring that all parts you buy from us are completely traceable or sourced directly from reputable manufacturers like Dla Land And Maritime. Obtain a quote now for 5962-8764903BYB. In any case if you don't find your required part submit our straight RFQ and get your part in on time.
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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-301-4165 Item Description: MICROCIRCUIT,MEMORY | 5962 | 013014165 | N | B | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
B | A | 0 | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
5962-8764903BYB | 3 | 1 | 4 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES UM" |
ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES UM" |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES UM" |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
AGAV | END ITEM IDENTIFICATION | ALQ-135B" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE AND BIDIRECTIONAL AND ERASABLE" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 26 INPUT" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS UM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS UM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS UM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
CZER | MEMORY DEVICE TYPE | ROM" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES UM" |
ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES UM" |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES UM" |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
AGAV | END ITEM IDENTIFICATION | ALQ-135B" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE AND BIDIRECTIONAL AND ERASABLE" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | 26 INPUT" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS UM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS UM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS UM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
CZER | MEMORY DEVICE TYPE | ROM" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS" |
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