If you require the NSN part 3262010-1, manufactured by Electrodynamics Inc having CAGE Code 10236 and categorized under FSC 5962 Microcircuits Electronic under NSN 5962013611587, then look no further than NSN Gamut. Our company, which is owned and managed by ASAP Semiconductor, a distributor in the aerospace and defense industry, has an inventory of over two billion new and obsolete NSN parts, including part 3262010-1 Microcircuit Memory and many more.
At NSN Gamut, we have a strict policy of not sourcing from China, ensuring that all parts you buy from us are completely traceable or sourced directly from reputable manufacturers like Electrodynamics Inc. Obtain a quote now for 3262010-1. In any case if you don't find your required part submit our straight RFQ and get your part in on time.
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We offer a vast range of NSN 5962013611587 parts, including 3262010-1, with quick lead times and competitive prices. NSN Gamut has a large selection of in-demand parts from manufacturers such as Electrodynamics Inc and others. To speak with a dedicated account manager, just submit an RFQ for 3262010-1 with your basic details like your company name parts quantity required, and get your quote in 15 minutes or less.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-361-1587 Item Description: Microcircuit Memory | 5962 | 013611587 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
3262010-1 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | PROGRAMMED AND ULTRAVIOLET ERASABLE AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM INPUT AND 6.5 VOLTS MAXIMUM INPUT |
CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM ACCESS |
CZER | MEMORY DEVICE TYPE | EPROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CZEP | CAPITANCE RATING PER CHARACTERISTIC | 12.00 INPUT PICOFARADS MAXIMUM AND 14.00 OUTPUT PICOFARADS MAXIMUM |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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