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Quality guaranteed We sell only warrantied and traceable partsIf you require the NSN part HM9-0044C1526, manufactured by Intersil Inc having CAGE Code 34371 and categorized under FSC 5962 Microcircuits Electronic under NSN 5962002347278, then look no further than NSN Gamut. Our company, which is owned and managed by ASAP Semiconductor, a distributor in the aerospace and defense industry, has an inventory of over two billion new and obsolete NSN parts, including part HM9-0044C1526 Microcircuit Memory and many more.
At NSN Gamut, we have a strict policy of not sourcing from China, ensuring that all parts you buy from us are completely traceable or sourced directly from reputable manufacturers like Intersil Inc. Obtain a quote now for HM9-0044C1526. In any case if you don't find your required part submit our straight RFQ and get your part in on time.
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We offer a vast range of NSN 5962002347278 parts, including HM9-0044C1526, with quick lead times and competitive prices. NSN Gamut has a large selection of in-demand parts from manufacturers such as Intersil Inc and others. To speak with a dedicated account manager, just submit an RFQ for HM9-0044C1526 with your basic details like your company name parts quantity required, and get your quote in 15 minutes or less.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-234-7278 Item Description: Microcircuit Memory | 5962 | 002347278 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | G | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Hm9-0044c1526 | C | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.260 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.150 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.025 INCHES MINIMUM AND 0.045 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | PROGRAMMED AND HERMETICALLY SEALED AND BURN IN |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-84 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | GOLD |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | DIODE MATRIX |
| PMLC | III PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |
| PRMT | III PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-750 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
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