If you require the NSN part 5353-1F, manufactured by Mmi Amd having CAGE Code 50364 and categorized under FSC 5962 Microcircuits Electronic under NSN 5962011234784, then look no further than NSN Gamut. Our company, which is owned and managed by ASAP Semiconductor, a distributor in the aerospace and defense industry, has an inventory of over two billion new and obsolete NSN parts, including part 5353-1F Microcircuit Memory and many more.
At NSN Gamut, we have a strict policy of not sourcing from China, ensuring that all parts you buy from us are completely traceable or sourced directly from reputable manufacturers like Mmi Amd. Obtain a quote now for 5353-1F. In any case if you don't find your required part submit our straight RFQ and get your part in on time.
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We offer a vast range of NSN 5962011234784 parts, including 5353-1F, with quick lead times and competitive prices. NSN Gamut has a large selection of in-demand parts from manufacturers such as Mmi Amd and others. To speak with a dedicated account manager, just submit an RFQ for 5353-1F with your basic details like your company name parts quantity required, and get your quote in 15 minutes or less.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-123-4784 Item Description: Microcircuit Memory | 5962 | 011234784 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | G | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
5353-1f | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.090 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 175.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT |
CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER OR GOLD |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |
PRMT | PRECIOUS MATERIAL | GOLD |
TEST | TEST DATA DOCUMENT | 82577-932883 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
TTQY | TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
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