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Quality guaranteed We sell only warrantied and traceable partsIf you require the NSN part WS57C256F-70DMB, manufactured by Waferscale Integration Inc having CAGE Code 66579 and categorized under FSC 5962 Microcircuits Electronic under NSN 5962013897020, then look no further than NSN Gamut. Our company, which is owned and managed by ASAP Semiconductor, a distributor in the aerospace and defense industry, has an inventory of over two billion new and obsolete NSN parts, including part WS57C256F-70DMB Microcircuit Memory and many more.
At NSN Gamut, we have a strict policy of not sourcing from China, ensuring that all parts you buy from us are completely traceable or sourced directly from reputable manufacturers like Waferscale Integration Inc. Obtain a quote now for WS57C256F-70DMB. In any case if you don't find your required part submit our straight RFQ and get your part in on time.
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We offer a vast range of NSN 5962013897020 parts, including WS57C256F-70DMB, with quick lead times and competitive prices. NSN Gamut has a large selection of in-demand parts from manufacturers such as Waferscale Integration Inc and others. To speak with a dedicated account manager, just submit an RFQ for WS57C256F-70DMB with your basic details like your company name parts quantity required, and get your quote in 15 minutes or less.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-389-7020 Item Description: Microcircuit Memory | 5962 | 013897020 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Ws57c256f-70dmb | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 37.85 MILLIMETERS MAXIMUM |
| ADAT | BODY WIDTH | 12.70 MILLIMETERS MINIMUM AND 15.49 MILLIMETERS MAXIMUM |
| ADAU | BODY HEIGHT | 4.40 MILLIMETERS MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED AND ULTRAVIOLET ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 90.00 MILLIAMPERES MAXIMUM INPUT DRIVE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 14.0 VOLTS NOMINAL TOTAL SUPPLY |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS |
| CZER | MEMORY DEVICE TYPE | EPROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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